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Plasol Inc., South Korea

Low Frequency Plasma Asher

Model: PES-200
Plasol PES-200 low frequency plasma asher with touchscreen and front chamber door

Key Features

  • Low-pressure plasma treatment: a dry-etching process that modifies the near-surface layer without damaging the bulk material properties
  • Low frequency generator: up to 500 W (level control 0–⁠100%) at 10–⁠50 kHz, with active fan cooling
  • CCP discharge with dual electrodes for high plasma uniformity and conformal treatment of intricate contours and various sample sizes
  • Supports ashing, etching and descum, plus hydrophilic / hydrophobic treatment, cleaning and activation
  • Rectangular chamber of 200 × 230 × 100 mm (W × D × H) in anodized aluminum (6061)
  • Up to 4 mass flow controllers (0–⁠100 sccm) for O2 or air, N2, Ar, CF4 and other gases; designed for fluorine-based gases
  • Fully automatic mode (10 recipes) and manual mode, set from a 10.1-inch touchscreen PC
  • Adjustable power (W), gas flow (sccm) and duration (mm:ss), with a Pirani gauge (0.5 mTorr to atmosphere) for pressure measurement

About the Plasol PES-200 Low Frequency Plasma Asher

The PES-200 from Plasol Inc., South Korea, is a plasma surface treatment system that the manufacturer calls a low pressure plasma cleaner. Its low frequency generator (10–⁠50 kHz, up to 500 W) works in a rectangular chamber that accommodates samples of various sizes and shapes, and the system supports plasma ashing, etching and descum.

It is designed to use fluorine-based gases, and up to four mass flow controllers (0–⁠100 sccm) feed process gases such as O2 or air, N2, Ar and CF4. Besides ashing, etching and descum it performs surface modification treatments, including hydrophilic and hydrophobic treatment, cleaning and activation.

Plasma is generated by capacitively coupled plasma (CCP) discharge between dual electrodes, which gives high plasma uniformity and conformal treatment of intricate contours. An embedded system with a 10.1-inch touchscreen runs recipe-driven automatic operation (10 recipes) or manual mode, and a Pirani gauge, mass flow controllers and a finely adjustable generator provide accurate process control.

PES-200 specifications

Technical specifications of the Plasol PES-200 low frequency plasma asher
ModelPES-200
ManufacturerPlasol Inc., South Korea
TypeLow pressure plasma cleaner (low frequency plasma asher)
Plasma dischargeCCP (capacitively coupled plasma) with dual electrodes
GeneratorMax. 500 W, level control 0–⁠100%
Frequency10–⁠50 kHz, active fan cooling
Process gasesO2 or air, N2, Ar, CF4 and others (1/4" Lok fittings); designed for fluorine-based gases
Mass flow controllersMax. 4 (0–⁠100 sccm)
Reactor chamberW 200 × D 230 × H 100 mm, rectangular; anodized aluminum (6061)
Pressure gaugePirani, 0.5 mTorr to atmosphere
Vent and N2 purge inlet1 channel each
OperationFully automatic mode (10 recipes in total) and manual mode
Control10.1" touchscreen PC (Linux embedded system)
Adjustable parametersPower (W), gas flow (sccm) and duration (mm:ss)
Configurable optionsVent and purge time (s), working pressure (Torr), chamber and gas valve open/close, vacuum pump on/off
Vacuum pump2-stage oil rotary pump (RV12, Edwards); peak pumping speed 8.4 cfm (238 L/min); KF25 connection; W 430 × D 158 × H 261 mm; 220 V AC supplied by the plasma cleaner
Ultimate pressure1.5 × 10⁻³ Torr (1.5 × 10⁻² Torr with Fomblin®)
System dimensionsW 410 × D 575 × H 660 mm
Electrical supply110–⁠250 V AC
ComplianceCE

Specifications are as published by the manufacturer, Plasol. Download the product brochure or contact us to confirm the configuration for your laboratory.

Low frequency plasma asher: frequently asked questions

Is the Plasol PES-200 a plasma cleaner or a plasma asher?

Both names describe the same system. Plasol calls the PES-200 a low pressure plasma cleaner. It operates at a low frequency (10–50 kHz) and supports plasma ashing, etching and descum processes as well as surface modification, so it is also known as a low frequency plasma asher.

What is the PES-200 used for?

Typical applications listed by the manufacturer are PDMS microfluidic chip bonding and activation, hydrophilic or hydrophobic treatment of plastics, electrode cleaning and wire bonding, graphene and 2D TMD transfer and activation, photoresist removal, plasma ashing and descum, photocatalyst activation and OLED fabrication.

What generator and discharge does the PES-200 use?

A generator of up to 500 W with level control from 0 to 100%, operating at 10–50 kHz with active fan cooling. Plasma is formed by capacitively coupled plasma (CCP) discharge between dual electrodes, which gives high plasma uniformity.

Which process gases can the PES-200 use?

O2 or air, N2, Ar, CF4 and others, through 1/4 inch Lok fittings. The system is designed to use fluorine-based gases and can be fitted with up to four mass flow controllers (0–100 sccm).

How large is the chamber and how is the PES-200 controlled?

The rectangular reactor chamber is 200 × 230 × 100 mm (W × D × H) in anodized aluminum (6061). A 10.1-inch touchscreen PC with a Linux embedded system sets power, gas flow and duration, with a fully automatic mode (10 recipes) and a manual mode. A brochure is available from the button at the top of this page.

Where can I buy the Plasol PES-200 in India?

Multiflo Instruments, based in Navi Mumbai, supplies Plasol plasma systems in India. Our team can advise on the PES-200, send a quotation, and arrange installation, training, calibration and after-sales service. Use the Contact Us button or call +91-22-44516175.

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